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Philips Semiconductors
PCF85103C-2
256 × 8-bit CMOS EEPROM with I 2 C-bus interface
14.4 Package related soldering information
Table 10:
Suitability of IC packages for wave, re?ow and dipping soldering methods
Mounting
Package [1]
Soldering method
Wave
Re?ow [2]
Dipping
Through-hole
DBS, DIP, HDIP, RDBS,
suitable [3]
?
suitable
mount
SDIP, SIL
Through-hole-
PMFP [4]
not suitable
not
?
surface mount
suitable
Surface mount
BGA, LBGA, LFBGA,
not suitable
suitable
?
SQFP, SSOP-T [5] ,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
not suitable [6]
suitable
?
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC [7] , SO, SOJ
suitable
suitable
?
LQFP, QFP, TQFP
not
recommended [7][8]
suitable
?
SSOP, TSSOP, VSO,
not recommended [9]
suitable
?
VSSOP
9397 750 14218
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales of?ce.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to re?ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared re?ow
soldering with peak temperature exceeding 217 ° C ± 10 ° C measured in the atmosphere of the re?ow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 04 — 22 October 2004
17 of 20
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